MODULE 1 : TOOLING
(View Complete Item Description)THIS MODULE CONTAIN 4 TOPIC :1. IDENTIFY STANDARD GEOMETRIC DIMENSIONING AND TOLERANCEdule contain 4 top2. MECHANICAL TOOLS3. MEASURING INSTRUMENT4. OSCILLOSCOPES
Material Type: Lesson Plan
All resources in ORGANIZE TOOLING MANAGEMENT 2018
Electronics
(View Complete Item Description)This module describe about electronics application on IC manufacturing machines. Here, student will learn about machines in Front of Line (FOL) and End of Line (EOL) such as Wafer mounting, Die Attach/Bond, Wire Bond, 3rd Optical, Trimming, Moulding, Testing etc.
Material Type: Module
Logical Sensor
(View Complete Item Description)This module describe about various sensor application on IC manufacturing machines. Here, student will learn about types, function, limitation, datasheet of sensor which prominently used in relevant machine.
Material Type: Module
IC Packaging technology
(View Complete Item Description)learning about packaging for IC semiconductor from the die form until complete
Material Type: Module
IT OR COMPUTER TECHNOLOGY
(View Complete Item Description)This Module is about Computer Technology
Material Type: Module
vision system
(View Complete Item Description)vision system :1.Definition of machine vision system2.Application of machine vision system3.Components in machine vision4.Limit
Material Type: Module
Geometric, Dimensiong & Tolerance
(View Complete Item Description)Mechanical drawing
Material Type: Module